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Case example video
Solder void horizontal cross section images under chip resistor by UHS 3D Oblique CT.
Cross-sectional slice image of VIA connections in interposer substrate taken by 3D oblique CT
Cross-sectional slice image of through-silicon via
3D Oblique CT scan of 1005 size chip inductor
Analysis example of a PKG that caused a short circuit due to contamination between wire bondings
The case where a fingerprint sensor was non-destructively observed using a high-magnification 3D oblique CT.
Non-destructive observation of smartphone PCB board using UHS 3D X-ray oblique CT.